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GaN E-mode HEMT Device
650V 8A 225mΩ

Absolute Maximum Ratings(Tcase = 25°C except as noted)

Symbol

Parameter

Value

Unit

TJ

Operating Junction Temperature

-55 to +150

°C

TS

Storage Temperature Range

-55 to +150

°C

VDS

Drain-to-Source Voltage

650

V

VDS(transient)

Drain-to-Source Voltage - transient 1

850

V

VGS

Gate-to-Source Voltage

-10 to +7

V

VGS(transient)

Gate-to-Source Voltage - transient 1

-20 to +10

V

IDS

Continuous Drain Current (Tcase = 25 °C)

8

A

IDS

Continuous Drain Current (Tcase = 100 °C)

5

A

IDS Pulse

Pulse Drain Current (Pulse width 10 µs, VGS = 6 V) 2

13.5

A

Note    
1. For < 1 µs.
2. Defined by product design and characterization. Value is not tested to full current in production.


 Electrical Characteristics (Typical values at TJ = 25°C , VGS = 6V unless otherwise noted)

Symbol

Parameter

Conditions

Min

Typ

Max

Unit

V(BL)DSS

Drain-to-Source Blocking Voltage

VGS = 0 V, IDSS < 13 µA

650



V

RDS(on)

Drain-to-Source On Resistance

VGS= 6 V, TJ= 25°C, IDS = 2.2 A


225

285

mΩ

RDS(on)

Drain-to-Source On Resistance

VG= 6 V, TJ= 150°C, IDS = 2.2 A


569


mΩ

VGS(th)

Gate-to-Source Threshold

VDS = VGS, IDS = 1.7 mA

1.1

1.7

2.6

V

IGS

Gate-to-Source Current

VGS = 6 V, VDS = 0 V


40


µA

Vplat

Gate Plateau Voltage

VDS = 400 V, IDS = 8 A


3.5


V

IDSS

Drain-to-Source Leakage Current

VDS= 650 V, VGS= 0 V, TJ = 25°C


0.5

13

µA

IDSS

Drain-to-Source Leakage Current

VDS= 650 V, VGS= 0 V, T= 150°C


102


µA

RG

Internal Gate Resistance

f = 5 MHz


2


CISS

Input Capacitance

VDS = 400 V 

VGS = 0 V 

f = 100 kHz


54


pF

COSS

Output Capacitance


14


pF

CRSS

Reverse Transfer Capacitance


0.3


pF

QG

Total Gate Charge

VGS = 0 to 6 V

VDS = 400 V


1.6


nC

QGS

Gate-to-Source Charge


0.5


nC

QGD

Gate-to-Drain Charge


0.5


nC

QOSS

Output Charge

VGS = 0 V, VDS = 400 V


14


nC

QRR

Reverse Recovery Charge



0


nC


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